Intelligence Layers & Domain Modules
Domain Modules
| Module | Coverage | Key Capabilities |
|---|---|---|
| Hardware Engineering | PCB, chip architecture, LPU/AI processor, manufacturing machines | Schematic generation, BOM, Gerber files, VHDL/Verilog for custom silicon |
| Materials Science | Properties, US sourcing, cost, environmental lifecycle | Substitution recommendations, supplier integration, environmental scoring |
| Manufacturing Systems | Factory line design, batch processes, QC, automation | Process flows, equipment spec, yield modeling |
| Software Engineering | Full-stack, embedded, firmware, AI | Production-grade code with enforced design principles |
| Chemistry & Materials | Compounds, synthesis, novel material discovery | PubChem/ChemRxiv retrieval, synthesis feasibility, safety analysis |
| Patent Intelligence | Global patents — USPTO, EPO, WIPO, JPO | Prior art search, novelty windows, provisional claim drafting |
| Whitepaper & Standards | IEEE, IPC, JEDEC, AI research | Standards compliance, document synthesis, gap analysis |
| Environmental Systems | Carbon accounting, renewable integration | Impact scoring, net-positive pathway recommendations |
Recursive Reasoning — Overflow Prevention
HIIE uses iterative deepening with hard depth limits and SSD checkpointing rather than pure recursion. A similarity detection threshold (τ = 0.92) forces divergent reasoning when outputs converge. RAM pressure monitoring triggers state serialization to SSD above 85% utilization.